Curvilinear Mask Patterning For Maximizing Lithography Entitlement

Manufacturing, Packaging & Materials WHITEPAPERS Practical solutions to overcome the computational challenges associated with this Read More →

Blog Review: November 15

Systems & Design Bringing up USB4 links; TCAD improves DTCO; electrical/electronic co-design for PCBs; metalenses; Read More →

OKI develops GaN lifting-off/bonding technology on Shin-Etsu’s QST substrates

News: Microelectronics 14 November 2023 In collaboration with Shin-Etsu Chemical Co Ltd, Tokyo-based Oki Electric Read More →

VisIC launches top-side-cooled isolated package

News: Microelectronics 14 November 2023 VisIC Technologies Ltd of Ness Ziona, Israel – a fabless Read More →

Technical Paper Roundup: November 14

Industry Research Nanowire FETs; laterally gated FeFETs for in-memory computing; LLMs for chip design; RowHammer Read More →

Research Bits: November 14

Solid-state thermal transistor for heat management Researchers from University of California Los Angeles created a Read More →

Highly Stacked Nanowire FETs To Enhance Drive Current And Transistor Density

A technical paper titled “Fabrication and performance of highly stacked GeSi nanowire field effect transistors” Read More →

Stacked Ferroelectric Memory Array Comprised Of Laterally Gated Ferroelectric Field-Effect Transistors

A technical paper titled “Laterally gated ferroelectric field effect transistor (LG-FeFET) using α-In2Se3  for stacked in-memory Read More →

Applications Of Large Language Models For Industrial Chip Design (NVIDIA)

A technical paper titled “ChipNeMo: Domain-Adapted LLMs for Chip Design” was published by researchers at Read More →

BAE Systems awarded $5m ONR contract for COALESCE program

News: Microelectronics 10 November 2023 BAE Systems ─ which develops and services electric propulsion technology Read More →

NUBURU completes US Air Force AFWERX SBIR Phase II contract

News: Optoelectronics 10 November 2023 NUBURU Inc of Centennial, CO, USA — which was founded Read More →

Ascent’s CIGS technology achieves specific power 1900W/kg at AM0

News: Photovoltaics 9 November 2023 Ascent Solar Technologies Inc of Thornton, CO, USA — which Read More →

Vishay to acquire Nexperia’s Newport Wafer Fab for $177m

News: Microelectronics 9 November 2023 Discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc Read More →

Flipping Processor Design On Its Head

AI is changing processor design in fundamental ways, combining customized processing elements for specific AI Read More →

Modulated Electron Microscopy Applied In The Process Monitoring Of Memory Cell And The Defect Inspection Of Floating Circuits

A technical paper titled “In situ electrical property quantification of memory devices by modulated electron Read More →

Discrete Noise Approximation When Modeling The Effects Of Noise On Quantum Circuits

A technical paper titled “The Discrete Noise Approximation in Quantum Circuits” was published by researchers Read More →

Diamond Foundry creates first 100mm single-crystal diamond wafer

News: Suppliers 6 November 2023 Diamond Foundry Inc (DF) of San Francisco, CA, USA says that it Read More →

Coding And Debugging RISC-V

As monolithic device scaling continues to wind down and evolve toward increasingly heterogeneous designs, it Read More →

Understanding Memory Protection Units

Let’s talk about the various security measures we take to protect our homes. We use Read More →

Navitas’ GaNFast 25W fast charger adopted for Samsung’s flagship Galaxy S23 phone

News: Microelectronics 3 November 2023 Gallium nitride (GaN) power IC and silicon carbide (SiC) technology Read More →

Hitachi Power Semiconductor Device to be transferred to MinebeaMitsumi

News: Microelectronics 3 November 2023 Tokyo-based Hitachi Ltd has agreed to transfer all the shares Read More →

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