BluGlass highlights progress in March quarter

For the three months ended 31 March (fiscal Q3/2024), BluGlass Ltd of Silverwater, Australia — Read More →

UMC introduces first 3D IC solution for RFSOI

Semiconductor foundry United Microelectronics Corp of Hsinchu, Taiwan has announced what it claims is the Read More →

Fundamental Issues In Computer Vision Still Unresolved

Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS Read More →

Design Considerations In Photonics

Experts at the Table: Semiconductor Engineering sat down to talk about what CMOS and photonics Read More →

Shin-Etsu Chemical to start developing a new market with ShineGrip™, a new type of adhesive technology

Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) agreed to Read More →

BluGlass and Applied Energetics sign MoU to collaborate

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser Read More →

Navitas celebrates tenth anniversary

In a series of events during 2024, beginning with the IEEE Applied Power Electronics Conference Read More →

Photonics: Harnessing The Power of Light

All around us, light is at work. The cameras on our phones, the parking sensors Read More →

The Seven Pillars Of IC Package Physical Design

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth Read More →

SemiQ debuting QSiC 1200V MOSFET modules at APEC

In booth #2245 at the Applied Power Electronics Conference (APEC 2024) in Long Beach, CA Read More →

Porotech and Powerchip partner on mass producing 200mm GaN-on-Si micro-LEDs for displays

Fabless micro-LED company Poro Technologies Ltd (a spin off from the Cambridge Centre for Gallium Read More →

Infineon and Wolfspeed expand and extend multi-year 150mm SiC wafer supply agreement

Infineon Technologies AG of Munich, Germany and Wolfspeed Inc of Durham, NC, USA — which Read More →

Busch and Pfeiffer Vacuum jointly constructing sales, systems and service center in Switzerland

Vacuum pumps and systems manufacturer Busch Vacuum Solutions of Maulburg, Germany and Pfeiffer Vacuum of Read More →

Rethinking Memory

Experts at the Table: Semiconductor Engineering sat down to talk about the path forward for Read More →

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages Read More →

Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and Read More →

Navigating Heat In Advanced Packaging

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law Read More →

Top500: Frontier Still On Top, Sunway Formally Reappears

New versions of the Top500 and Green500 lists have been released, and Frontier continues its Read More →

Trendspotting: Automotive IC Startup Funding In 2023

Consumers expect a lot from the electronics in their cars. The parts in the safety-critical Read More →

Key Inflection Points Influencing Bluetooth Low Energy Sourcing Decisions

Bluetooth 5.4, the latest specification from the Bluetooth Special Interest Group (SIG), includes a number Read More →

A*STAR and centrotherm partner on 200mm silicon carbide technology

A partnership has been announced that combines the 200mm open R&D silicon carbide (SiC) pilot Read More →

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