Semiconductor foundry United Microelectronics Corp of Hsinchu, Taiwan has announced what it claims is the first 3D IC solution for radio-frequency silicon-on-insulator (RFSOI) technology. Available on UMC’s 55nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of RF performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G… Source: https://www.semiconductor-today.com/news_items/2024/may/umc-030524.shtml
