ams OSRAM adds OSLON UV 3535 series to mid-power UV-C LED range

ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has introduced the OSLON UV 3535 Read More →

big changes ahead in power delivery materials and interconnects

Big Changes Ahead In Power Delivery, Materials, And Interconnects

Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report Read More →

renesas cyberon speech recognition

Renesas / Cyberon Speech Recognition

This website uses cookies to improve your experience while you navigate through the website. The Read More →

Veeco releases new sustainability report

News: Suppliers 21 March 2023 Epitaxial deposition and process equipment maker Veeco Instruments Inc of Read More →

Navitas surpasses 75 million GaN power shipments

News: Microelectronics 21 March 2023 Gallium nitride (GaN) power IC and silicon carbide (SiC) technology Read More →

china chip industry startup funding annual report analysis 2022

China Chip Industry Startup Funding Annual Report & Analysis: 2022

Startup Corner More than 700 chip industry-related companies raised $19B across 821 funding rounds in Read More →

research bits march 21

Research Bits: March 21

Micropatterning with sugar A scientist at the National Institute of Standards and Technology (NIST) discovered Read More →

mini consortia forming around chiplets

Mini-Consortia Forming Around Chiplets

Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization Read More →

room temperature metal bonding technology that facilitates the fabrication of 3d ics 3d integration with heterogeneous devices

Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices

A technical paper titled “Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Read More →

large scale nanometer thick graphite film ngf as a euv pellicle

Large-Scale Nanometer-Thick Graphite Film (NGF) As A EUV Pellicle

A new technical paper titled “Graphite Pellicle: Physical Shield for Next-Generation EUV Lithography Technology” was Read More →

evaluation of the thermomechanical reliability of electronic packages using virtual prototyping

Evaluation of the Thermomechanical Reliability of Electronic Packages Using Virtual Prototyping

A new technical paper titled “Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Read More →

Startup Funding in China 2022: Sortable Funding Chart

This website uses cookies to improve your experience while you navigate through the website. The Read More →

onsemi showcasing intelligent power technologies at APEC

News: Microelectronics 16 March 2023 In booth 1032 at the Applied Power Electronics Conference (APEC Read More →

Tower announces first heterogeneous integration of QD lasers on SiPho foundry platform

News: Optoelectronics 16 March 2023 Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel, Read More →

Lumentum receives Excellent Core Partner Award from FiberHome

News: Optoelectronics 16 March 2023 Lumentum Holdings Inc of San Jose, CA, USA (which designs Read More →

Richardson to distribute Navitas’ SiC power semiconductors in Americas

News: Microelectronics 16 March 2023 Gallium nitride (GaN) power IC and silicon carbide (SiC) technology Read More →

CSconnected highlighted in UK’s new £2.5bn Quantum Strategy

News: Suppliers 16 March 2023 The South Wales-based compound semiconductor cluster CSconnected is highlighted in Read More →

tech forecast fab processes to watch through 2040

Tech Forecast: Fab Processes To Watch Through 2040

The massive proliferation of semiconductors in more markets, and more applications within those markets, is Read More →

getting smarter about tool maintenance

Getting Smarter About Tool Maintenance

Chipmakers have begun to shift to predictive maintenance for process tools, but the hefty investment Read More →

big shifts at very small geometries

Big Shifts At Very Small Geometries

The number of changes across the semiconductor industry are accelerating and widening. There are more Read More →