BluGlass and Applied Energetics sign MoU to collaborate

BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser Read More →

Navitas celebrates tenth anniversary

In a series of events during 2024, beginning with the IEEE Applied Power Electronics Conference Read More →

Photonics: Harnessing The Power of Light

All around us, light is at work. The cameras on our phones, the parking sensors Read More →

The Seven Pillars Of IC Package Physical Design

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth Read More →

SemiQ debuting QSiC 1200V MOSFET modules at APEC

In booth #2245 at the Applied Power Electronics Conference (APEC 2024) in Long Beach, CA Read More →

Porotech and Powerchip partner on mass producing 200mm GaN-on-Si micro-LEDs for displays

Fabless micro-LED company Poro Technologies Ltd (a spin off from the Cambridge Centre for Gallium Read More →

Infineon and Wolfspeed expand and extend multi-year 150mm SiC wafer supply agreement

Infineon Technologies AG of Munich, Germany and Wolfspeed Inc of Durham, NC, USA — which Read More →

Busch and Pfeiffer Vacuum jointly constructing sales, systems and service center in Switzerland

Vacuum pumps and systems manufacturer Busch Vacuum Solutions of Maulburg, Germany and Pfeiffer Vacuum of Read More →

Rethinking Memory

Experts at the Table: Semiconductor Engineering sat down to talk about the path forward for Read More →

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages Read More →

Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and Read More →

Navigating Heat In Advanced Packaging

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law Read More →

Top500: Frontier Still On Top, Sunway Formally Reappears

New versions of the Top500 and Green500 lists have been released, and Frontier continues its Read More →

Trendspotting: Automotive IC Startup Funding In 2023

Consumers expect a lot from the electronics in their cars. The parts in the safety-critical Read More →

Key Inflection Points Influencing Bluetooth Low Energy Sourcing Decisions

Bluetooth 5.4, the latest specification from the Bluetooth Special Interest Group (SIG), includes a number Read More →

A*STAR and centrotherm partner on 200mm silicon carbide technology

A partnership has been announced that combines the 200mm open R&D silicon carbide (SiC) pilot Read More →

Using Real Workloads To Assess Thermal Impacts

Thermal analysis is being driven much further left in the design, fueled by demand for Read More →

Data Formats For Inference On The Edge

AI/ML training traditionally has been performed using floating point data formats, primarily because that is Read More →

CSconnected welcomes UK’s £160m semiconductor investment zone in South Wales

A recently announced investment zone in the UK is to focus on further strengthening the Read More →

ROHM expands library of LTspice models to over 3500 by adding SiC and IGBTs

Japan’s ROHM has expanded its lineup of SPICE models for the LTspice circuit simulator, increasing Read More →

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