Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and high bandwidth memory (HBM). The bridge dies provide localized communications among the multiple system on chips (SoCs) in a single package. In Amkor’s bridge technology, S-Connect provides die-to-die connections with fine pitch [1]. Prototype S-Connect technology was first reported in 2021 with a chip-first process. . . . The results show that the chip-last S-Connect can be an advanced package solution for high-end applications.
Authors from R&D, Amkor Technology Korea, Incheon, Korea:
- Heejun Jang
- Kyun Ahn
- Haesung Par
- Gamhan Yong
- Jihyun Ki
- YeonKi Jeong
- EunSook Sohn
- Taekyeong Hwang
- Wonchul Do
- JinYoung Khim
Advanced Package and Technology Integration, Amkor Technology,Inc., Tempe, AZ, USA:
- Dave Hiner
- Mike Kelly
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H. Jang et al., “Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging,” 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1027-1031, doi: 10.1109/ECTC51909.2023.00175.