Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and Read More →

Big Shifts In Power Electronics Packaging

The power semiconductor market is poised for remarkable growth in the next several years, fueled Read More →

IC Manufacturing Targets Less Water, Less Waste

Fabs, OSATs, and equipment makers are accelerating their efforts to reduce water usage while cutting Read More →

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One Read More →

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing Read More →

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In Read More →

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and Read More →

Challenges Of Heterogeneous Integration

Heterogeneous integration opens the door to an almost unlimited number of features in a single Read More →

DAC/Semicon West Addresses Top Issues, Trends For Chips

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, Read More →

Smart Manufacturing Makes Gains In Chip Industry

Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and Read More →

High-Density Fan-Out Packaging With Fine Pitch Embedded Trace RDL

The needs of high-performance devices for artificial intelligence (AI), high performance computing (HPC) and data Read More →

Challenges Grow For Creating Smaller Bumps For Flip Chips

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but Read More →

Big Changes Ahead In Power Delivery, Materials, And Interconnects

Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report Read More →

Getting Smarter About Tool Maintenance

Chipmakers have begun to shift to predictive maintenance for process tools, but the hefty investment Read More →

Revising 5G RF Calibration Procedures For RF IC Production Testing

Modern radio frequency (RF) components introduce many challenges to outsourced semiconductor assembly and test (OSAT) Read More →

Test Challenges Mount As Demands For Reliability Increase

An emphasis of improving semiconductor quality is beginning to spread well beyond just data centers Read More →

Managing Thermal-Induced Stress In Chips

At advanced nodes and in the most advanced packages, physics is no one’s friend. Escalating Read More →

How AiP/AoP Technology Helps Enable 5G And More

Home OPINION How AiP/AoP modules can be used In lieu of a separate RF system Read More →

Bump Reliability is Challenged By Latent Defects

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical Read More →

Chip Industry’s Earnings Roundup

Many companies reported revenue growth in the most recent quarter, but the latest round of Read More →

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