Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages Read More →

Electromigration Performance Of Fine-Line Cu Redistribution Layer (RDL) For HDFO Packaging

The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and Read More →

Navigating Heat In Advanced Packaging

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law Read More →

Big Shifts In Power Electronics Packaging

The power semiconductor market is poised for remarkable growth in the next several years, fueled Read More →

IC Manufacturing Targets Less Water, Less Waste

Fabs, OSATs, and equipment makers are accelerating their efforts to reduce water usage while cutting Read More →

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One Read More →

Increasing AI Energy Efficiency With Compute In Memory

Skyrocketing AI compute workloads and fixed power budgets are forcing chip and system architects to Read More →

Curvilinear Mask Patterning For Maximizing Lithography Entitlement

Manufacturing, Packaging & Materials WHITEPAPERS Practical solutions to overcome the computational challenges associated with this Read More →

Gearing Up For Hybrid Bonding

Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor Read More →

Big Changes Ahead For Photomask Technology

The move to curvilinear shapes on photomasks is gaining steam after years of promise as Read More →

Wirebonding Is Here To Stay

Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. Read More →

Heterogeneous Integration Finding Its Footing

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Read More →

The Impact Of Channel Hole Profiles On Advanced 3D NAND Structures

In a two-tier 3D NAND structure, the upper and lower channel hole profile can be Read More →

Why Curvy Design Now? Less Change Than You Think And Manufacturable Today

A curvilinear (curvy) chip, if magically made possible, would be smaller, faster, and use less Read More →

Negative-Tone Photosensitive Polymeric Bonding Material To Enable Room Temperature Prebond For Cu/Polymer Hybrid Bonding

Manufacturing, Packaging & Materials WHITEPAPERS An evaluation of a negative-tone i-line photosensitive polymeric bonding material Read More →

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing Read More →

When And Where To Implement AI/ML In Fabs

Deciphering complex interactions between variables is where machine learning and deep learning shine, but figuring Read More →

Ferroelectric Memories Answer Call For Non-Volatile Alternatives

As system designers seek to manipulate larger data sets while reducing power consumption, ferroelectric memory Read More →

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In Read More →

Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It

Have you ever seen roots or tree branches take a 90-degree turn? Have you ever seen Read More →

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent Read More →

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