Semiconductor Archives - Page 3 of 54

imec and SMART Photonics sign MoU to work on hybrid integration of InP on SiN/SiPh

News: Optoelectronics 16 November 2023 Nanoelectronics research center imec of Leuven, Belgium and independent pure-play Read More →

Big Shifts In Power Electronics Packaging

The power semiconductor market is poised for remarkable growth in the next several years, fueled Read More →

IC Manufacturing Targets Less Water, Less Waste

Fabs, OSATs, and equipment makers are accelerating their efforts to reduce water usage while cutting Read More →

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One Read More →

Increasing AI Energy Efficiency With Compute In Memory

Skyrocketing AI compute workloads and fixed power budgets are forcing chip and system architects to Read More →

Marktech launches 235nm and 255nm UVC LEDs

News: LEDs 15 November 2023 Marktech Optoelectronics Inc of Latham, NY, USA, a designer and Read More →

NUBURU announces $5.5m bridge financing

News: Optoelectronics 15 November 2023 NUBURU Inc of Centennial, CO, USA — which was founded Read More →

Curvilinear Mask Patterning For Maximizing Lithography Entitlement

Manufacturing, Packaging & Materials WHITEPAPERS Practical solutions to overcome the computational challenges associated with this Read More →

Blog Review: November 15

Systems & Design Bringing up USB4 links; TCAD improves DTCO; electrical/electronic co-design for PCBs; metalenses; Read More →

OKI develops GaN lifting-off/bonding technology on Shin-Etsu’s QST substrates

News: Microelectronics 14 November 2023 In collaboration with Shin-Etsu Chemical Co Ltd, Tokyo-based Oki Electric Read More →

VisIC launches top-side-cooled isolated package

News: Microelectronics 14 November 2023 VisIC Technologies Ltd of Ness Ziona, Israel – a fabless Read More →

Technical Paper Roundup: November 14

Industry Research Nanowire FETs; laterally gated FeFETs for in-memory computing; LLMs for chip design; RowHammer Read More →

Research Bits: November 14

Solid-state thermal transistor for heat management Researchers from University of California Los Angeles created a Read More →

Highly Stacked Nanowire FETs To Enhance Drive Current And Transistor Density

A technical paper titled “Fabrication and performance of highly stacked GeSi nanowire field effect transistors” Read More →

Stacked Ferroelectric Memory Array Comprised Of Laterally Gated Ferroelectric Field-Effect Transistors

A technical paper titled “Laterally gated ferroelectric field effect transistor (LG-FeFET) using α-In2Se3 for stacked in-memory Read More →

Applications Of Large Language Models For Industrial Chip Design (NVIDIA)

A technical paper titled “ChipNeMo: Domain-Adapted LLMs for Chip Design” was published by researchers at Read More →

BAE Systems awarded $5m ONR contract for COALESCE program

News: Microelectronics 10 November 2023 BAE Systems ─ which develops and services electric propulsion technology Read More →

NUBURU completes US Air Force AFWERX SBIR Phase II contract

News: Optoelectronics 10 November 2023 NUBURU Inc of Centennial, CO, USA — which was founded Read More →

Ascent’s CIGS technology achieves specific power 1900W/kg at AM0

News: Photovoltaics 9 November 2023 Ascent Solar Technologies Inc of Thornton, CO, USA — which Read More →

Vishay to acquire Nexperia’s Newport Wafer Fab for $177m

News: Microelectronics 9 November 2023 Discrete semiconductor and passive electronic component maker Vishay Intertechnology Inc Read More →

Flipping Processor Design On Its Head

AI is changing processor design in fundamental ways, combining customized processing elements for specific AI Read More →