News: Microelectronics 25 October 2023 Infineon Technologies AG of Munich, Germany has closed its acquisition Read More →
Experts at the Table: Semiconductor Engineering sat down to discuss the challenges of cost-dependent cloud Read More →
Shortened lifecycles and cost reduction coupled with the demand for advanced capabilities continue to challenge Read More →
A technical paper titled “Accelerating Defect Predictions in Semiconductors Using Graph Neural Networks” was published Read More →
A technical paper titled “Enabling HW-based Task Scheduling in Large Multicore Architectures” was published by Read More →
Sensors everywhere, more connected devices, and the rollout of smart everything has created a flood Read More →
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor Read More →
A technical paper titled “Energy Estimates Across Layers of Computing: From Devices to Large-Scale Applications Read More →
A technical paper titled “A Comprehensive Performance Study of Large Language Models on Novel AI Read More →
A technical paper titled “First demonstration of in-memory computing crossbar using multi-level Cell FeFET” was Read More →
The move to curvilinear shapes on photomasks is gaining steam after years of promise as Read More →
Few technologies in semiconductor manufacturing have stood the test of time as steadfastly as wirebonding. Read More →
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Read More →
In a two-tier 3D NAND structure, the upper and lower channel hole profile can be Read More →
A curvilinear (curvy) chip, if magically made possible, would be smaller, faster, and use less Read More →
