First Solar breaks ground on $1.1bn 3.5GW Louisiana factory

News: Photovoltaics 22 September 2023 Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Read More →

OIF’s multi-vendor interoperability demonstrations at ECOC feature 39 firms

News: Optoelectronics 21 September 2023 The Optical Internetworking Forum (OIF) says that, in its booth Read More →

Infineon providing 1200V CoolSiC MOSFETs for Infypower’s EV charger stations

News: Microelectronics 21 September 2023 Infineon Technologies AG of Munich, Germany is providing 1200V CoolSiC Read More →

Teledyne e2v HiRel releases rad-tolerant L- and S-band RF LNA for space & radar applications

News: Microelectronics 21 September 2023 Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of Read More →

Plasma-Therm acquires Thin Film Equipment

News: Suppliers 21 September 2023 Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process Read More →

AXT’s Tongmei receives initial export permits from China for GaAs and Ge substrates

News: Suppliers 21 September 2023 AXT Inc of Fremont, CA, USA – which makes gallium Read More →

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing Read More →

When And Where To Implement AI/ML In Fabs

Deciphering complex interactions between variables is where machine learning and deep learning shine, but figuring Read More →

Ferroelectric Memories Answer Call For Non-Volatile Alternatives

As system designers seek to manipulate larger data sets while reducing power consumption, ferroelectric memory Read More →

Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In Read More →

Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It

Have you ever seen roots or tree branches take a 90-degree turn? Have you ever seen Read More →

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent Read More →

New Plasma Power Technologies For Next-Gen Semiconductor Manufacturing

As chip designs push the limits of speed, size and complexity, the semiconductor industry has Read More →

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and Read More →

Camtek buying FormFactor’s FRT Metrology business for $100m

News: Suppliers 20 September 2023 Inspection and 3D metrology equipment maker Camtek Ltd of Migdal Read More →

IQE and VisIC to co-develop D-Mode GaN power devices for EVs

News: Microelectronics 20 September 2023 Epiwafer and substrate maker IQE plc of Cardiff, Wales, UK Read More →

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” Read More →

Framework for Prototyping And In-Hardware Evaluation of Post-Quantum Cryptography HW Accelerators (TU Darmstadt)

A technical paper titled “PQC-HA: A Framework for Prototyping and In-Hardware Evaluation of Post-Quantum Cryptography Read More →

Automotive semiconductor firm indie acquires EXALOS

News: Optoelectronics 19 September 2023 Automotive semiconductor and software platform provider indie Semiconductor Inc of Read More →

BluGlass receives custom GaN laser order from repeat customer

News: Optoelectronics 19 September 2023 BluGlass Ltd of Silverwater, Australia — which develops and manufactures Read More →

New customer orders Aehr FOX-NP multi-wafer test and burn-in system for silicon carbide MOSFETs

News: Suppliers 19 September 2023 Semiconductor production test, burn-in and reliability qualification equipment supplier Aehr Read More →

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