Altum RF showcases products at EuMW

News: Microelectronics 1 September 2023 Altum RF of Eindhoven, The Netherlands (which designs RF and Read More →

Transphorm highlighting high-voltage SuperGaN solutions for EVs at electronica India

News: Microelectronics 1 September 2023 Transphorm Inc of Goleta, near Santa Barbara, CA, USA — Read More →

ROHM launches power-stage ICs with built-in 650V GaN HEMTs and gate driver

News: Microelectronics 31 August 2023 Japan-based power semiconductor maker ROHM Co Ltd has developed the Read More →

Toshiba releases third-generation SiC MOSFETs with reduced switching losses

News: Microelectronics 31 August 2023 Toshiba is now shipping the TWxxxZxxxC series of ten silicon Read More →

Performance & Efficiency Cores For Servers

Systems & Design OPINION Scalable, flexible architectures are coming to server-class processors to better address Read More →

Need To Share Data Widens In IC Manufacturing

Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of Read More →

POET and JV partner SPX demonstrating 800G OSFP optical transceivers at CIOE

News: Optoelectronics 30 August 2023 In booth #11C63at the 24th China International Optoelectronics Expo (CIOE Read More →

SweGaN gains former Ericsson CEO as senior advisor

News: Microelectronics 30 August 2023 SweGaN AB of Linköping, Sweden, which develops and manufactures custom Read More →

Automotive Complexity, Supply Chain Strength Demands Tech Collaboration

The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers Read More →

Challenges In Ramping New Manufacturing Processes

Despite a slowdown for Moore’s Law, there are more new manufacturing processes are rolling out Read More →

Blog Review: August 30

Systems & Design LLM hallucinations and EDA; PCIe 6.0 shared flow control; multi-die verification; device Read More →

Toshiba ships first 2200V dual SiC MOSFET module

News: Microelectronics 29 August 2023 Japan-based Toshiba Electronic Devices & Storage Corp (TDSC) – which Read More →

EPCSpace adds rad-hard GaN devices in high-current G-Package

News: Microelectronics 29 August 2023 EPC Space LLC of Haverhill, MA, USA has introduced two Read More →

Security Research: Technical Paper Round-up

Industry Research HW-related security papers at the USENIX Security Symposium include remote direct memory introspection, Read More →

Research Bits: August 29

Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College Read More →

Manual X-ray Inspection

Increased density in advanced node chips and advanced packaging offers a way to greatly improve Read More →

New Concepts Required For Security Verification

Verification for security requires new practices in both the development and verification flows, but tools Read More →

Hardware-Assisted Malware Analysis

A technical paper titled “On the Feasibility of Malware Unpacking via Hardware-assisted Loop Profiling” was Read More →

Transient Execution Attacks That Leaks Arbitrary Kernel Memory (ETH Zurich)

A technical paper titled “Inception: Exposing New Attack Surfaces with Training in Transient Execution” was Read More →

Transphorm’s GaN powers first integrated micro-inverter PV systems by DAH Solar

News: Microelectronics 25 August 2023 Transphorm Inc of Goleta, near Santa Barbara, CA, USA — Read More →

NUBURU appoints John Bolton to board

News: Optoelectronics 24 August 2023 NUBURU Inc of Centennial, CO, USA — which was founded Read More →

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