Semiconductor

Leveraging In-Package Wireless Technology To Improve The Thermal Behavior Of 2.5D Chiplet-Based SoP

A technical paper titled “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal” was published by researchers at Swiss Federal Institute of Technology Lausanne (EPFL) and University of Applied Sciences and Arts of Western Switzerland (HES-SO). Abstract Excerpt “In this work, we propose a new task mapping heuristic that leverages in-package wireless technology to improve the thermal behavior

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Power Semiconductor Devices: Thermal Management and Packaging

A technical paper titled “Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective” was published by researchers at Virginia Polytechnic Institute and State University, U.S. Naval Research Laboratory, and Univ Lyon, CNRS. “This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged devices.

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Squeezing The Margins

Systems & Design OPINION Monitoring systems and quickly adjusting clock frequencies improves performance for specific applications and operating environments. Back in 2016, we looked at the MediaTek Helio X20, the first Tri-Gear mobile SoC. Tri-Gear is a step beyond ARM’s big.LITTLE concept of using two different cores that have unique power and performance characteristics, by adding a third core. The

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3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations

A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. Abstract“Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform real-time prediction for many unseen new designs.

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Solid-State Electrochemical Thermal Transistor Without Using Liquid

A new technical paper titled “Solid-State Electrochemical Thermal Transistors” was published by researchers at Hokkaido University, Pusan National University, and the University of Tokyo. Abstract “Thermal transistors that electrically control heat flow have attracted growing attention as thermal management devices and phonon logic circuits. Although several thermal transistors are demonstrated, the use of liquid electrolytes may limit the application from

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Modeling and Thermal Analysis of 3DIC

A new technical paper titled “Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers” was published by researchers at UT Arlington. “This work presents a theoretical model to determine the steady state temperature distribution in a general M-layer structure with spatial variation in thermal contact resistance between adjacent layers,” states the paper. Find the technical

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