Tag: Test Measurement and Analytics
Isolating Critical Data In Failure Analysis
Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of [more…]
Using Smart Data To Boost Semiconductor Reliability
The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In [more…]
Optimizing Metal Film Measurement On IGBT And MOSFET Power Devices With Picosecond Ultrasonic Technology
By Johnny Dai with Cheolkyu Kim and Priya Mukundhan In recent years, power semiconductor applications have expanded from industrial and consumer electronics to renewable energy and electric [more…]
Data, System Reliability, and Privacy
Experts at the Table: Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime, and over-arching concerns about data [more…]
Fab And Field Data Transforming Manufacturing Processes
The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product’s performance in real-time and [more…]
Customizing IC Test To Improve Yield And Reliability
Testing the performance and power of semiconductors as they come off the production line is beginning to shift left in the fab, reversing a long-standing trend of [more…]
Synopsys Timing Constraints Manager: Constraint Verification
Test, Measurement & Analytics WHITEPAPERS A constraint verification solution plays the role of a devil’s advocate when it brings to the attention of engineers sophisticated design/constraints issues [more…]
Chip Industry Week In Review
By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according [more…]
Need To Share Data Widens In IC Manufacturing
Experts at the Table: Semiconductor Engineering sat down to discuss issues in smart manufacturing of chips, including data management and grounding, chiplets, and standards, with Mujtaba Hamid, [more…]
Manual X-ray Inspection
Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect [more…]
Reducing Chip Test Costs With AI-Based Pattern Optimization
Test, Measurement & Analytics OPINION Artificial intelligence (AI) is an innovative way to meet the requirements for a modern test pattern generation flow. The old adage “time [more…]
Addressing Copper Clad Laminate Processing Distortion Using Overlay Corrections
All great voyages must come to an end. Such is the case with our series on the challenges facing the manufacturing of advanced IC substrates (AICS), the [more…]
Mission-Critical Devices Drive System-Level Test Expansion
System-level testing is becoming essential for testing complex and increasingly heterogeneous chips, driven by rising demand for reliable parts in safety- and mission-critical applications. More and more [more…]
How Software Can Help Redefine Semiconductor Validation
The rate of technological advancement is increasing faster than ever before. Although the demands for meeting aggressive time-to-market requirements and innovating at warp speed are not new, [more…]
Governments Begin To Shape Metrology Directions
Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe impact in nearly every sector of the worldwide economy, and especially the [more…]
Ditch The Glitch
To support the ever-growing performance demands of cutting-edge applications like automotive and hyperscaler, SoC complexity continues to increase. The emergence of multi-die technology has also compounded this [more…]
Striking A Balance In Acoustic Inspection
Sound energy is a quick way to to spot voids, delamination, cracks, and other possible defects that are accessible from outside the chip or package, as well [more…]
Pinpointing Timing Delays Can Improve Chip Reliability
Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and [more…]
3D Structures Challenge Wire Bond Inspection
Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem [more…]
Using AI To Improve Metrology Tooling
Virtual metrology is carefully being added into semiconductor manufacturing, where it is showing positive results, but the chip industry is proceeding cautiously. The first use of this [more…]
What Data Center Chipmakers Can Learn From Automotive
Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, [more…]
