Tag: National Metrology Institute of Japan
Chip Industry’s Technical Paper Roundup: Feb. 21
Industry Research LBIST for auto MCUs using a digital twin; HW-SW co-design for side-channel protected NN inference; near-memory FPGA graph processing framework; AFM & photoresists; acceleration of [more…]
Measuring 3D Sidewall Topography & LER for Photoresist Patterns Using Tip-Tilting AFM Technology
A new technical paper titled “Enhancing the precision of 3D sidewall measurements of photoresist using atomic force microscopy with a tip-tilting technique” by researchers at National Metrology [more…]