Intel’s Meteor Lake chips are coming to desktops after all

The on/off saga of Meteor Lake for desktops has been settled once and for all. Read More →

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing Read More →

Performance & Efficiency Cores For Servers

Systems & Design OPINION Scalable, flexible architectures are coming to server-class processors to better address Read More →

Who Will Regulate Data Exchanges In Chiplets?

Scaling is still important when it comes to logic and low power, but it’s no Read More →

Directed Self-Assembly Finds Its Footing

Ten years ago, when the industry was struggling to deliver EUV lithography, directed self-assembly (DSA) Read More →

Specialization Vs. Generalization In Processors

Academia has been looking at specialization for many years, but solutions were rejected because general-purpose Read More →

Chip Industry Needs More Trust, Not Zero Trust

CISOs from Intel, TSMC, ASML, Applied Materials, and Lam Research unanimously called for the semiconductor Read More →

DAC/Semicon West Addresses Top Issues, Trends For Chips

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, Read More →

Governments Begin To Shape Metrology Directions

Disruptions to the global semiconductor supply chain caused by the COVID-19 pandemic had a severe Read More →

Chiplet Security Risks Underestimated

The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less Read More →

Do Necessary Tools Exist For RISC-V Verification?

Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group Read More →

Big Changes Ahead In Power Delivery, Materials, And Interconnects

Part one of this forecast looked at evolving transistor architectures and lithography platforms. This report Read More →

Tech Forecast: Fab Processes To Watch Through 2040

The massive proliferation of semiconductors in more markets, and more applications within those markets, is Read More →

Chip Industry’s Technical Paper Roundup: Mar. 6

This website uses cookies to improve your experience while you navigate through the website. The Read More →

Agile HW Design: Fully Automatic Equivalence Checking Workflow

A new technical paper titled “An Equivalence Checking Framework for Agile Hardware Design” was published Read More →

Week In Review: Manufacturing, Test

Manufacturing, Packaging & Materials CHIPS Act progress; Samsung 5nm; new U.S. plants; China manufacturing viability; Read More →

Chip Industry’s Technical Paper Roundup: Feb. 21

Industry Research LBIST for auto MCUs using a digital twin; HW-SW co-design for side-channel protected Read More →

Devices And Transistors For The Next 75 Years

The 75th anniversary of the invention of the transistor sparked a lively panel discussion at Read More →

2D Semiconductor Materials Creep Toward Manufacturing

As transistors scale down, they need thinner channels to achieve adequate channel control. In silicon, Read More →

Chiplets Taking Root As Silicon-Proven Hard IP

Chiplets are all the rage today, and for good reason. With the various ways to Read More →