Tag: inspection
Isolating Critical Data In Failure Analysis
Experts at the Table: Semiconductor Engineering sat down to discuss traceability and the lack of data needed to perform root cause analysis with Frank Chen, director of [more…]
5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success
Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or [more…]
Fab And Field Data Transforming Manufacturing Processes
The ability to capture, process, and analyze data in the field is transforming semiconductor metrology and testing, providing invaluable insight into a product’s performance in real-time and [more…]
Challenges Grow For Creating Smaller Bumps For Flip Chips
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with [more…]
3D Structures Challenge Wire Bond Inspection
Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem [more…]
What Data Center Chipmakers Can Learn From Automotive
Automotive OEMs are demanding their semiconductor suppliers achieve a nearly unmeasurable target of 10 defective parts per billion (DPPB). Whether this is realistic remains to be seen, [more…]
More Accurate And Detailed Analysis of Semiconductor Defects In SEM Images Using SEMI-PointRend
A technical paper titled “SEMI-PointRend: Improved Semiconductor Wafer Defect Classification and Segmentation as Rendering” was published (preprint) by researchers at imec, University of Ulsan, and KU Leuven. [more…]