Tag: Coventor
IC Manufacturing Targets Less Water, Less Waste
Fabs, OSATs, and equipment makers are accelerating their efforts to reduce water usage while cutting reducing and recycling material waste in a trend toward better sustainability. With [more…]
Blog Review: November 15
Systems & Design Bringing up USB4 links; TCAD improves DTCO; electrical/electronic co-design for PCBs; metalenses; ruthenium metal lines. Cadence’s Neelabh Singh explores the process of lane initialization [more…]
The Impact Of Channel Hole Profiles On Advanced 3D NAND Structures
In a two-tier 3D NAND structure, the upper and lower channel hole profile can be different, and this combination of different profiles leads to different top-down visible [more…]
Blog Review: June 21
Synopsys’ Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design workloads to the cloud, from ever-increasing compute and time-to-market demands to advanced [more…]
Improving DRAM Device Performance Through Saddle Fin Process Optimization
Manufacturing, Packaging & Materials OPINION Determining optimal fin height and curvature to increase channel length, prevent short channel effects, and increase data retention times. As DRAM technology [more…]
Blog Review: March 1
Systems & Design UVM Factory and collaboration; chiplet compatibility; SI/PI in data centers; digital twins and system-level design. Siemens EDA’s Chris Spear explains the UVM Factory and [more…]
The Other Side Of The Wafer: The Latest Developments In Backside Power Delivery
Home OPINION A look at the benefits of reducing wiring congestion at the most advanced nodes. At the beginning of my career in semiconductor equipment, the backside [more…]
