Tag: CNRS
Chip Industry’s Technical Paper Roundup: May 2
Industry Research Schottky barrier transistor; HW-accelerated RTL simulation; RISC-V microcontroller; GaN power devices; charging infrastructure and grid integration for electromobility; IFA for computing-in-memory; RISC-V vector HW for [more…]
Power Semiconductor Devices: Thermal Management and Packaging
A technical paper titled “Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective” was published by researchers at Virginia Polytechnic Institute [more…]