Tag: CMP
Gearing Up For Hybrid Bonding
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking [more…]
High-Density Fan-Out Packaging With Fine Pitch Embedded Trace RDL
The needs of high-performance devices for artificial intelligence (AI), high performance computing (HPC) and data center applications have drastically accelerated during the Covid-19 pandemic period. At the [more…]
