Tag: BoW
Heterogeneous Integration Finding Its Footing
Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; [more…]
Why Auto Ecosystem Relationships Are Changing
The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, [more…]
Chiplets: More Standards Needed
Low Power-High Performance OPINION Current chiplet interface standardization efforts fall short when it comes to handling analog signals and power. Recent months have seen new advances in [more…]
Will AI Take My Job?
Systems & Design OPINION A quick look at ChatGPT shows that while it is surprisingly good, it will not replace me anytime soon. Everyone is talking about [more…]
