Photonics: Harnessing The Power of Light

All around us, light is at work. The cameras on our phones, the parking sensors Read More →

Navigating Heat In Advanced Packaging

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law Read More →

Using Real Workloads To Assess Thermal Impacts

Thermal analysis is being driven much further left in the design, fueled by demand for Read More →

3D-ICs May Be The Least-Cost Option

When 2.5D and 3D packaging were first conceived, the general consensus was that only the Read More →

Blog Review: November 15

Systems & Design Bringing up USB4 links; TCAD improves DTCO; electrical/electronic co-design for PCBs; metalenses; Read More →

Flipping Processor Design On Its Head

AI is changing processor design in fundamental ways, combining customized processing elements for specific AI Read More →

What Will That Chip Cost?

In the past, analysts, consultants, and many other experts attempted to estimate the cost of Read More →

Anatomy Of A System Simulation

The semiconductor industry has greatly simplified analysis by consolidating around a small number of models Read More →

Partitioning Processors For AI Workloads

Partitioning in complex chips is beginning to resemble a high-stakes guessing game, where choices need Read More →

ReRAM Seeks To Replace NOR

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives Read More →

Fab And Field Data Transforming Manufacturing Processes

The ability to capture, process, and analyze data in the field is transforming semiconductor metrology Read More →

Chip Industry Week In Review

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year Read More →

Designing Vehicles Virtually

The shift toward software-defined vehicles (SDVs), electric vehicles (EVs), and ultimately autonomous vehicles (AVs) is Read More →

Automotive Complexity, Supply Chain Strength Demands Tech Collaboration

The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers Read More →

Blog Review: August 30

Systems & Design LLM hallucinations and EDA; PCIe 6.0 shared flow control; multi-die verification; device Read More →

Processor Tradeoffs For AI Workloads

AI is forcing fundamental shifts in chips used in data centers and in the tools Read More →

Battling Over Shrinking Physical Margin In Chips

Smaller process nodes, coupled with a continual quest to add more features into designs, are Read More →

Challenges Grow For Data Management And Sharing In EDA

Semiconductor Engineering sat down to talk about more openness in EDA data, how increased complexity Read More →

Blog Review: June 21

Synopsys’ Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design Read More →

EDA’s Role Grows For Preventing And Identifying Failures

The front end of design is becoming more tightly integrated with the back end of Read More →

Chip Design CEO Outlook

Semiconductor Engineering sat down with Joseph Sawicki, executive vice president for IC EDA at Siemens Read More →

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