A new technical paper titled “Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers” was published by researchers at UT Arlington.

“This work presents a theoretical model to determine the steady state temperature distribution in a general M-layer structure with spatial variation in thermal contact resistance between adjacent layers,” states the paper.

Find the technical paper here. Published January 2023.

Krishnan, Girish, and Ankur Jain. “Heat transfer in a multi-layered semiconductor device with spatially-varying thermal contact resistance between layers.” International Communications in Heat and Mass Transfer 140 (2023): 106482.

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Source: https://semiengineering.com/24220276-2/