A new technical paper titled “ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design was written by researchers at National Taiwan University of Science and Technology.
“In this paper, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-dependent constraints but also take the problem of mismatched via dimension into account, which is caused by the mechanical processes and greatly increases design complexity,” states the paper.
Find the technical paper here. January 2023.
Wu, Jun-Sheng, Chi-An Pan, and Yi-Yu Liu. “ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design.” ACM Transactions on Design Automation of Electronic Systems (2023).