Millimeter wave frequencies are essential for transferring more data more quickly, but it also requires different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges ranging from over-the-air testing and cross talk to impedance matching.
Ed Sperling
(all posts)
Ed Sperling is the editor in chief of Semiconductor Engineering.
Source: https://semiengineering.com/challenges-of-packaging-5g-and-6g/
