Formal Verification Best Practices: Investigating A Deadlock

To ensure a design is deadlock free with formal verification, one approach consists in verifying Read More →

Integration Of Layered Semimetals With Conventional CMOS Platform

A technical paper titled “Layered semimetal electrodes for future heterogeneous electronics” was published by researchers Read More →

Friction Between Single Layer Graphene And An Atomic Force Microscope Tip

A technical paper titled “Dynamically tuning friction at the graphene interface using the field effect” Read More →

Seoul Semiconductor exhibits LEDs at SID’s Vehicle Displays & Interfaces Symposium

News: LEDs 27 September 2023 Seoul Semiconductor exhibits LEDs at SID’s Vehicle Displays & Interfaces Read More →

ROHM launches sensor for attachment/detachment and proximity detection

News: Optoelectronics 27 September 2023 Japan-based ROHM has developed the compact (2.0mm x 1.0mm) RPR-0720 Read More →

ams OSRAM unveils ALIYOS LED-on-foil technology for automotive lighting

News: LEDs 26 September 2023 ams OSRAM unveils ALIYOS LED-on-foil technology for automotive lighting At Read More →

NUBURU extends independent chairman’s role to executive chairman

News: Optoelectronics 26 September 2023 NUBURU Inc of Centennial, CO, USA — which was founded Read More →

Chip Industry’s Technical Paper Roundup: September 26

This website uses cookies to improve your experience while you navigate through the website. The Read More →

Research Bits: September 26

2D waveguides Researchers from the University of Chicago found that a sheet of glass crystal Read More →

Cambridge GaN Devices incorporates individual 2D barcode on GaN ICs

News: Microelectronics 25 September 2023 Cambridge GaN Devices Ltd (CGD) — which was spun out Read More →

IQE’s first-half revenue down about 40% year-on-year

News: Suppliers 25 September 2023 For first-half 2023, epiwafer and substrate maker IQE plc of Read More →

ReRAM Seeks To Replace NOR

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives Read More →

UV LED maker Nitek sues Photon Wave in USA

News: LEDs 22 September 2023 UV LED maker Nitek sues Photon Wave in USA UV Read More →

Germany and Bavaria governments to provide €300m IPCEI funding for ams OSRAM to expand opto R&D and manufacturing

News: Optoelectronics 22 September 2023 ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has Read More →

First Solar breaks ground on $1.1bn 3.5GW Louisiana factory

News: Photovoltaics 22 September 2023 Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Read More →

OIF’s multi-vendor interoperability demonstrations at ECOC feature 39 firms

News: Optoelectronics 21 September 2023 The Optical Internetworking Forum (OIF) says that, in its booth Read More →

Infineon providing 1200V CoolSiC MOSFETs for Infypower’s EV charger stations

News: Microelectronics 21 September 2023 Infineon Technologies AG of Munich, Germany is providing 1200V CoolSiC Read More →

Teledyne e2v HiRel releases rad-tolerant L- and S-band RF LNA for space & radar applications

News: Microelectronics 21 September 2023 Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of Read More →

Plasma-Therm acquires Thin Film Equipment

News: Suppliers 21 September 2023 Plasma-Therm LLC of St Petersburg, FL, USA (which makes plasma-process Read More →

AXT’s Tongmei receives initial export permits from China for GaAs and Ge substrates

News: Suppliers 21 September 2023 AXT Inc of Fremont, CA, USA – which makes gallium Read More →

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing Read More →

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